中国芯网

Company	PartNo	Q'ty	Device type	Digital Channel	Analog Channel	Pattem Deep	Tester frequency	Voltage Scale	Current Scale	VI Source	Current Source
VTT	777	15	Dig+Mem	128	0	16k*1M	10MHz	+/-35V	+/-500mA	8	8
TRI	TR- 6010	20	Digital	128	0	16k*2M	10MHz	+/-18V	+/-1A	8	8
TRI	TR- 6800	2	Mix	32	16	16k*2M	20MHz	+/-32V	+/-2A	16	16
SYSTEST	Q2- 52	10	Memory	40	0	4M	10MHz	+/-20V	+/-500mA	8	8
YTEC	SCUD 256	10	Mix	32	32	1M	10MHz	+/-45/15	+/-2A	16	16
Teradyne	J750	2	Digtal	512	0	4M	50MHz	+/-24V	+/-200A	8	8
Teradyne	A540	2	Mix	24	16	16k*1M	25MHz	0-200V	+/-200mA	6	6
Agilent	HP 93000	2	Mix	512	16	14M	100MHz	+/-22V	+/-8A	16	16

探针台系统配置介绍（Prober System Configuration）

Company

Part No.

Q'TY

Offline linking

Heading

Contact type

Testing wafer size

3 inch

4 inch

5 inch

6 inch

8 inch

EG

EG2001

15

Availble

Available

Cable+Mau palter

A

A

A

A

A

TSK

UF200A

15

Available

Available

Cable+Mau palter

　

A

A

A

A

切割设备、挑粒设备、减薄设备系统介绍
（Cutting、 Sorting、 Grinding Machine Syetem Configuration）

Item

Company

Q'ty

Wafer Size Ability

3 inch

4 inch

5 inch

6 inch

8 inch

Dicing

DISCO

2

A

A

A

A

A

Cleaning

DISCO

1

A

A

A

A

A

Sorting

KINGBOND

2

A

A

A

A

A

Gringing

DISCO

1

A

A

A

A

A

Taping

NITTO

1

A

A

A

A

A

De-taping

NITTO

1

A

A

A

A

A

UV mapping

ARON DENKI

1

A

A

A

A

A

Microscope

GZ

15

-

-

-

-

-

Vacuum pack

GZ

2

-

-

-

-

-

Oven

ESPEC

3

-

-

-

-

-

ESD Detector

SIMCO

2

-

-

-

-

-

ESD Fan

SHIN HAN

1

-

-

-

-

-

机械手、编带机、处观检查机系统配置介绍
（Handler、taping、Machine Lead Scan Machine Configuration）

Item

Company

Part
No.

Q'ty

Contact
Type

Final Product Outline

DIP

SOP

HSOP

QFP

PLCC

TSSOP

SSOP

SIP

Handler

MULTITEST

TTSOP

2

Normal
+kevin

-

-

-

-

-

A

-

-

SSOP

2

Normal
+kevin

-

-

-

-

-

-

A

-

SEIMJESS

DIP

15

Normal

A

-

-

-

-

-

-

-

SOP/HSOP

10

Normal

-

A

A

-

-

-

-

-

TRIPOD

TO/SIP

8

Normal

-

-

-

-

-

-

-

A

SEIKO EPSON

NS6000

2

Normal

-

-

-

-

A

A

A

-

CHIPRIGHT

3400

2

Normal

-

-

-

-

A

A

A

-

Lead Scan

ROOD

LS800

1

-

-

-

-

-

A

A

A

-

Taping

ISMECA

NT16

1

-

-

-

A

A

A

A

A

-

切封装外形能力介绍（Package and Testing Ability）

类型(Type)

Body Width

8 PIN

14 PIN

16
PIN

18
PIN

20
PIN

22
PIN

24
PIN

28
PIN

30
PIN

32
PIN

44
PIN

48
PIN

54
PIN

64
PIN

128
PIN

DIP

300MIL

A

A

A

A

A

A

A

A

A

A

-

-

-

-

-

DIP

600MIL

-

-

-

-

-

-

A

A

A

A

-

-

-

-

-

SDIP

300MIL

-

-

-

-

A

A

A

A

-

-

-

-

-

-

-

SOP

150MIL

A

A

A

-

-

-

-

-

-

-

-

-

-

-

-

SOP

300MIL

-

-

-

A

A

A

A

A

-

-

-

-

-

-

-

HSOP

300MIL

-

-

-

-

-

-

-

A

-

-

-

-

-

-

-

SSOP

209MIL

-

-

-

-

A

-

A

A

-

-

-

A

-

-

-

TSSOP

173MIL

-

-

-

-

A

-

-

-

-

-

-

-

A

-

-

QFP

10*10MM

-

-

-

-

-

-

-

-

-

A

A

-

-

A

A

分立器件Disceret

类型Type

3 PIN

4 PIN

23

25

26

89

92

220

220FP

252FP

143

343

263

223

SIP

A

A

-

-

-

-

-

-

-

-

-

-

-

-

TO

-

-

-

-

-

-

A

A

A

A

-

-

-

-

SOT

-

-

A

A

A

A

-

-

-

-

-

-

-

　

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